发光二极管DIP346mm红光带卡
待议
发光二极管DIP346mm红光带卡
一、外形图 Outline dimensions
单位 Unit | 公差 Tolerance | 芯片材料 Die material | 胶体颜色 Lens color | 发光颜色 Emission color |
mm | ±0.2mm | InGaN | 水透 | 红光 |
二、 光电参数Photoelectricity Parameter
(环境温度Ambient temperature:25℃ 湿度humidity:RH60%)
项目 Item | 符号Symbol | 测试条件 Test condition | 最小值 Min | 典型值 Type | 最大值 Max | 单位 Unit |
正向电压 Forward voltage | VF | IF=20mA | 1.9 | 2.0 | 2.2 | V |
反向电流 Reverse current | IR | VR=5V | -- | -- | 10 | μA |
发光强度 Luminous intensity | IV | IF=20mA | 800 | ---- | 900 | mcd |
主波长 Dominant wavelength | λd | IF=20mA | 622 | -- | 625 | nm |
光谱半宽度 Spectrum line half width | Δλ | IF=20mA | -- | 25 | -- | nm |
视 角 Viewing Angle | 2θ1/2 | IF=20mA | -- | 80 | -- | deg |
静电解除极限 ESD Withstand limit | ESD | -- | -- | -- | 2000 | V |
备注:亮度测试公差±15%、波长测试公差±1nm、正向电压测试公差±0.05V
三、极限参数Absolute Maximum Rating
(环境温度Ambient temperature:25℃ 湿度humidity:RH60%)
项 目 Item
| 符号 Symbol | 数值 Value | 单位 Unit | 备注 Remark |
正向电流 Forward Current
| IF | 25 | mA | --- |
正向峰值电流 Peck forward current | IFM | 75 | mA | F=1KHZ,占空比(duty cycle)1/10 |
反向耐压 Reverse Voltage | VRP | 15 | V | --- |
耗散功率 Power Dissipation | Pm | 85 | mW | --- |
工作环境温度Operation temperature | Tamb | -25至+80 | ℃ | --- |
贮藏温度 Storage temperature | Tstg | -35至+85 | ℃ | --- |
焊接温度 Soldering temperature | Tsol | 260 | ℃ | 波峰焊,离环氧体3mm处≤3S Wave soldering, 3mm out of physical body, ≤3S
|
四、典型光电特性曲线图Typical photoelectricity characteristic curve chart
五、可靠性实验项目Reliability Test Project
描述 Description | 项目 Item | 测试标准 Test criterion | 测试条件 Test condition | 测试时间 Test time | 数量 Qty | 失效数量 Fail qty |
寿命测试 Life test | 常温寿命测试 Life test(room temperature) | JIS7021:B4 | Ta=25℃±5℃,IF=30mA | 1000Hrs | 22 | 0 |
环境测试 Ambience test | 高温存储 High temperature store | JIS7021:B10 MIL-STD-202:210A MIL-STD-750:2031 | Ta=85℃±5℃ | 1000Hrs | 22 | 0 |
低温存储 Low temperature store | JIS7021:B12 | Ta= -35℃±5℃ | 1000Hrs | 22 | 0 | |
高温高湿测试 High temperature/ humidity test | JIS7021:B11 MIL-STD-202:103D | Ta=85℃±5℃ RH=85% | 1000Hrs | 22 | 0 | |
冷热冲击测试 Cold / Heat strike test | JIS7021::B4 MIL-STD-202:107D MIL-STD-750:1026 | 30min -10℃±5℃←→100℃±5℃ 5min 5min | 50Cycles | 22 | 0 | |
冷热循环测试 Cold and heat cycle test | JIS7021:A3 MIL-STD-202:107D MIL-STD-705:105E | 5min 5min 5min -35℃~25℃~85℃~25℃ 30min 5min 30min 5min | 50Cycles | 22 | 0 |
判断标准Judging criterion:
项目 Item | 符号 Symbol | 实验条件 Experiment condition | 判断标准 Criteria | |
Min. | Max. | |||
Forward Voltage | VF | IF=20mA | ---- | Initial Datex1.1 |
Reverse Current | IR | VR=5V | ---- | 10μA |
Luminous Intensity | IV | IF=20mA | Initial Datex0.8 | ---- |
六、注意事项 Note
(一)引脚成形方法Led bracket forming method
(1)必需离胶体2毫米才能折弯支架。
The pin of led can be bent where is at least 2mm out of led colloid.
(2)支架成形必须用夹具或由专业人员来完成。
Must use fixture to deform the led bracket.
(3)支架成形必须在焊接前完成。
Finishing the forming of led bracket must be before soldering.
(4)支架成形需保证引脚和间距与线路板上一致。
Guarantee the gap between two pin of led tallys with LED pads in PCB when forming.
(二)烙铁焊接 Manual soldering
烙铁(最高30W)尖端温度不超过260℃;焊接时间不超过3秒;焊接位置至少离胶体3毫米。
The tip temperature of soldering iron don’t exceed 330℃;soldering time don’t exceed 3s and soldering position must be 3mm out of led colloid。
可靠性焊接温度(A图、B图)Soldering temperature curve chart(figure A、figure B)
A图
波峰焊
B图
回流焊
(三)防静电措施ESD countermeasure
静电及高压会对LED造成损坏,特别是晶片材质为InGaN的产品对静电防护要求更加严格,要求在使用和检验产品时戴防静电手腕带或防静电手套,焊接工具及设备外壳需可靠接地,焊接条件遵循此份规格书中的条件。
Static electricity and high volt can damage led,The production whose Die material is InGaN must strictly required to prevent ESD,Must put on static glove and static fillet,Soldering tool and the cover of device must connect the ground,soldering condition follows the related stating of production specification manual。
(四)过电流保护Protecting countermeasure when over current
为避免由于电压的变化引起大电流冲击而造成产品损坏,需要加入保护电阻。
Need add the protecting resistor in circuit in order to avoid damaging led due to big current and voltage fluctuation。
(五)LED安装方法LED installation method
1)注意各类器件外线的排列以防极性装错,器件不可与发热元件靠得太近,工作条件不要超过其规定的极限。
Pay attention to the led polarity and avoid installation wrong。Led can’t be close to euthermic component,work condition should tally with it’s specification。
2)务必不要在引脚间距变形的情况下安装LED。
Don’t install the LED under the condition of the led pin deformation。
3)当装配LED进入PCB或装配孔时,LED支架不能承受任何压力。
The led bracket don’t load any pressure when installing the led into PCB or fitting hole。
4)在焊接温度回到正常以前,必须避免使LED受到任何的震动或外力。
Must avoid any strike and force on led before the soldering temperature return to room temperature。
(六)存储时间Storage time
1)在温度5℃~35℃,湿度RH60%条件下,产品可保存半年。超过保存期的产品需重新检测后方能使用。
Led can be stored for a year under the condition: the temperature of 5℃~35℃ and humidity of RH60%,These production must be re-inspected and tested before use if their storage time Half a year。
2)如果打开的产品在5℃~35℃,RH60%的空气条件下放置超过一周,则需要将产品在65℃±5℃的环境中放置24小时以上,并尽量在一周天内使用。
If led is exposed in air for a week under the condition: the temperature of 5℃~35℃,humidity of RH60%,must place the led in the ambience of 65℃±5℃ for 24 hours and use it in a Weeks for best。
(七)清洗Cleaning
当用化学用品清洗胶体时必须特别小心,因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙酮等。可用乙醇擦拭、浸渍,时间在常温下不超过3分钟。
Be careful of some chemical results in the led colloid fades and damage when using chemical clean the led,such as chloroethylene, acetone etc。 can use ethanol to wash or soak led but the time don’t exceed 3 minutes.
(八)弯脚(Kinked)
当LED 成形弯脚时,弯脚模具容易刮花LED脚支架镀层,刮伤处容易生锈,特别是空气湿度大时。 为减少生锈机会,建议使用镀锡支架。
The kinked tooling scrape easily the pin of led, where the led bracket is rusting easily, especial expose it in moist air. To decrease the led bracket rust, advise using plated tin led bracket.
七、包装Packing
(1)包装材料Packing material:防静电袋static bag
(2)标识remark:
(3)每袋数量Qty/per bag:500PCS(特殊情况可按要求而定Can change the qty according to actual status)
(4)外装纸箱Packing box
注:包装材料和外装纸箱根据客户下单实际情况定。
Remark:Decide detail packing box according to customer order or actual status。
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